Electronics Forum | Fri Sep 06 15:22:53 EDT 2002 | barryg
Genny, we recently went through the same scenerio. First to consider is your budget. Second , what type of components (fine pitch, bga, chip components)that you would be placing. Also consider board size max. that you would be doing and would see you
Electronics Forum | Thu Sep 12 15:58:02 EDT 2002 | stepheno
It's been years since I worked with a Fuji. I only once resorted to the undocumented part class 255 (or whatever they call it) and that was when I was working midnight shift. The smaller nozzle working better than the larger nozzle makes me wonder a
Electronics Forum | Tue Sep 24 07:32:58 EDT 2002 | cyber_wolf
Pete: It is a Panasonic Camera. MPM tells me that they no longer sell parts for that vision system, and in order to fix this problem I have to do a vision up-grade. The upgrade is over 20K if I remember correctly. That is not going to happen. I hav
Electronics Forum | Wed Oct 16 08:38:12 EDT 2002 | caldon
OK Brian- I did my home work...Here are deep fried Twinkie links: http://baking.about.com/library/recipes/blmisc6.htm http://www.foxnews.com/story/0,2933,54280,00.html as on new paper put it..."boiled fat" Yummie. Thank goodness me being in Philadel
Electronics Forum | Mon Oct 14 17:28:08 EDT 2002 | msimkin
Russ, Thanks for the feedback. Yeh, we are placing them in production using a full ball detect Yamaha placement machine, 5 thou square stencil. etc.etc. The only reason I raised this concern was from a rework point of veiw (actually, the board desi
Electronics Forum | Sat Oct 26 08:01:17 EDT 2002 | davef
IIT is a reputable supplier. They will be more than happy, happy to help a newbie get a good product. Continuing, at one level of product design sophistication ordering by remote will provide you with a perfectly acceptable stencil. But on the o
Electronics Forum | Wed Oct 30 10:26:42 EST 2002 | Randy V.
I would perform a simple solderability test per ANSI/J-STD-002. You can do this using a compatable no-clean flux like Indium NC771 and a solder pot. If the leads wet well you do not have a solderability problem. I did not notice what plating was on t
Electronics Forum | Fri Nov 01 14:27:27 EST 2002 | kenBliss
Based on this thread Shouldn�t the handling systems allow the worker to do what is needed on the board during the stated hand operation so the worker has minimal direct contact with it. Now for the non sales pitch, sales pitch. Doesn�t it make the
Electronics Forum | Wed Nov 06 14:57:56 EST 2002 | rmorford
Nothing funny seems to happen to the connector when heated. I have no idea how to monitor the temperature of a good pad vs. a bad pad because I have no idea before reflow which ones will be good and which will be bad. I did take a board and rip the
Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ
What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste
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