Electronics Forum: die attach (Page 1 of 8)

BGA attach eval.

Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf

I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro

BGA attach eval.

Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr

Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne

Die attach with solder paste

Electronics Forum | Fri Aug 30 06:18:55 EDT 2002 | seje

Thanks Jim, that should help. And yes, there is light at the end of the tunnel.... now : ) -Sasu-

Die attach with solder paste

Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje

Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t


Electronics Forum | Fri Aug 14 11:01:43 EDT 2020 | charliedci

Looking for someone who can perform die attach, wirebonding and gloptop services on small quantity of SMT assemblies in the US.

Chip Die Damage

Electronics Forum | Fri Dec 07 09:54:05 EST 2012 | davef

Try MIL-STD-883 Method 2017 Die inspection service providers may be willing to help Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com SMTA has published a lot of papers that track to 'die' & 'inspection' but most oft

Re: Photonic Soldering

Electronics Forum | Wed Sep 20 10:00:40 EDT 2000 | Erick Russell

Yes, some testing of soldering chip capacitors onto ceramic substrates with high temperature paste proved successful. Die attachment can be achieved using this technology as well. The underfill of the die becomes a critical factor in rework potentia

What's The Resolution?

Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef

What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 11:51:35 EDT 2017 | cyber_wolf

Rob, I believe that is for die attach voiding not solder interface.

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