Electronics Forum | Fri May 05 15:38:39 EDT 2023 | proceng1
I am not familiar with that machine, but with most of my machines, there is a transformer with several different taps. You just move a couple wires around. Though two of my machines, one of which is a JUKI, required an external transformer.
Electronics Forum | Mon May 15 11:41:00 EDT 2023 | tommy_magyar
I used a different machine in the past (Essemtec - FLX) where the program loading window was very similar to the one you uploaded. What worked for me, is clicking on one of the files in the window, and start typing the program you are searching for.
Electronics Forum | Sun Jun 25 15:55:23 EDT 2023 | smtusa
The specifications are very similar. Is the key difference speed between them? MG1 being ~10% faster? Will the ipulse take abuse like MG1? MG1 is 2x more expensive, can buy 2 ipulse M2s instead of 1 MG1.
Electronics Forum | Thu Jul 06 12:23:43 EDT 2023 | poly
On my one and I think all of them you need to do it manually. Send the stencil shuttle to front, There's two hex screws either side (4 total) you need to loosen. There a little indicator for the different common sizes. Then send the shuttle to the
Electronics Forum | Tue Jul 18 00:02:41 EDT 2023 | hazira1991
Yes. i do check all the parameter all seams good. I did compare my solder paste printing and profile with previous lot that did not have any BGA solder short issue which we run at the same line did not have any much difference. During rework also i
Electronics Forum | Fri Jul 21 01:50:04 EDT 2023 | auriga2001
The purpose is explained in the program 'help' - 'contents' menu. Due to viscosity and adhesion of different fluxes, paste may stick to the stencil more than the board. Using steps allows the surface tension and gravity to pull the paste down; rather
Electronics Forum | Mon Oct 02 12:22:46 EDT 2023 | carl_p
Hi, I use this Material, you can get a few different types to work with certain sensors but I've used them for a solid 12 months now for reflowing. I'm using multiple board materials down to 0.4mm & I've had zero issues. https://www.datumalloys.com
Electronics Forum | Wed Oct 11 18:12:55 EDT 2023 | alexv
I don't think it's a stencil issue. You have an identical inductor next to t=it, that's perfectly straight. You have a problem in that location. I've seen some inductors be affected by slight magnetic forces in the reflow oven. Try to rotate the boar
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
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