Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Tue Jan 26 00:21:29 EST 1999 | Parvez Patel
Ya I agree with Dean. We've done quite a lot of work with the SRT Summit2000 rework station.The results have been satisfactory, to say the least. One should however characterize the different operating parameters:namely the working scavenger air flow
Electronics Forum | Thu Jan 14 22:52:28 EST 1999 | Wayne
I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some const
Electronics Forum | Wed Dec 16 19:37:19 EST 1998 | Ron Costa
I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 14
Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Thu Oct 29 17:43:46 EST 1998 | Guillermo Villegas
Does anybody know how to update a different nozzle than the standard one on a Fuji IP3 machine? I want to use a 15.8 mm height nozzle, but the limit on height size is 10 mm for IP3.I know, I need to use a special nozzle, so I�m trying with a 16.00 m
Electronics Forum | Mon Oct 26 20:09:19 EST 1998 | Dave F
| I'm very new to the SMT process but I'm tasked to qualify a MPM Printer and a Panasert PnP m/c. The product consists of 6-10 different parts of a total of around 70. Please advice on the parameters for each m/c which I should focus on for optmizati
Electronics Forum | Mon Oct 26 20:54:10 EST 1998 | Jimmy strain
| I'm very new to the SMT process but I'm tasked to qualify a MPM Printer and a Panasert PnP m/c. The product consists of 6-10 different parts of a total of around 70. Please advice on the parameters for each m/c which I should focus on for optmizati
Electronics Forum | Wed Oct 21 02:15:01 EDT 1998 | Kevin Christy
Dear Folks: I am currently in the pre-prep stages of a market study that's focusing on different methods of microprocessor cooling and the market potentials of new designs. I wonder if you might be so kind as to point me to good general resources s
Electronics Forum | Thu Oct 22 14:20:57 EDT 1998 | Dave F
| Dear Folks: | | I am currently in the pre-prep stages of a market study that's focusing on different methods of microprocessor cooling and the market potentials of new designs. I wonder if you might be so kind as to point me to good general resou
