Electronics Forum | Wed Oct 10 21:35:39 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact recomm
Electronics Forum | Wed Oct 31 11:10:28 EST 2001 | Claude_Couture
In theory, no tweaking is necessary. Unless you happen to work with equipment old enough to vote! We have several lines with old MK chip shooters. of course, we use the same program for all the lines. There is no way to calibrate each machine so that
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Tue Oct 30 19:42:44 EST 2001 | davef
Jim Blankenhorn [www.smtplus.com] has the best understanding of designing pads for real life. That�s because he designs them like he wants to design them and doesn�t negotiate with a committee of thousands for an IPC standard. Consider doing this
Electronics Forum | Tue Oct 30 14:39:41 EST 2001 | markhoch
Has anybody else out there had problems with SMT connectors with plastic locating pins lifting up during the reflow process? We've had several instances with several differant types of SMT connectors lifting up during the reflow process. We've even g
Electronics Forum | Mon Nov 12 16:13:48 EST 2001 | davef
Underfill is primarily used in flip chip, CSP attach applications. It is used to balance the differing thermal expansion rates for an organic board, solder, and silicon die. There are a fair number of papers written on this in the SMTA [www.smta.or
Electronics Forum | Mon Nov 26 20:15:50 EST 2001 | davef
Sounds like you are thinking correctly. I'd guess your fab has gotten "smart" and changed your bare board, as you suggest. So, you've got two choices: 1 Rework the QFP. 2 Remove the lower temperature PTH components and solder them to the board some
Electronics Forum | Tue Nov 27 12:18:08 EST 2001 | Justin
We are currently looking for a way to measure pcb stress during our assembly process. We would like to get an idea of what amount of stress (flex) the boards are undergoing. We would also like to use this to compare a few different processes--for e
Electronics Forum | Tue Nov 27 20:32:38 EST 2001 | davef
Stress is meaningful if it affects the long term reliability in a product's end-use environment. I don�t believe that things are that straight forward, although it would be nice if they were. Consider that differences in materials, number of layers
Electronics Forum | Wed Dec 05 20:51:36 EST 2001 | davef
Mydata [http://www.mydata.se/] makes excellent placement machines with some unique features. They are: * Tailored high mix, high part count, fast turn production. * Not aimed a low mix, chip pukin� production. * For BIG butt boards. Aegis works fin
