Electronics Forum: differ (Page 6 of 580)

Re: Screen Print Eval Tool

Electronics Forum | Mon Aug 28 10:22:01 EDT 2000 | LarryK

There's a board called "SMTA Saber Board" that I have used. It has several different components types and is good in evaluating lots of different process equipment. This can be purchased from any of the "dummy" component companies.....

Re: motion detector

Electronics Forum | Sat Aug 12 09:29:58 EDT 2000 | Dave F

Barry: We use motion detectors: * In our product packaging to determine if the shipper has drop kicked the box down the stairs. * Along our conveyors in production to sense a "line full" These are far different applications and probably far diffe

Re: Squeegee Blades

Electronics Forum | Sat Feb 19 05:24:42 EST 2000 | Dane Stokes

I agree with Scott. When not in use we store the squeegee blades in the original plastic shipping containers. Keeping them in the containers also gives you something to label the sqeegees with as to different pitches or lenghts and different machine

Reflow of 0402 capacitors

Electronics Forum | Thu Mar 08 16:02:18 EST 2001 | gsmguru

Have you considered a different solderpaste ? A different flux chemistry may help. The metals content wouldn't have to change. Just go after a slightly more aggressive flux.

Waffle Tray Definition

Electronics Forum | Wed May 23 14:56:38 EDT 2001 | Steven Sicard

Seems like I can only find 1 definition for each type of trays (pga, mqfp, tqfp, ...) But there is alot of different type of trays with different sizes. Like Mqfp 14x14, 20x20 ...) Thanks

Re: small metallic bridging

Electronics Forum | Mon Dec 06 12:33:49 EST 1999 | Wolfgang Busko

Hi Glen, is it a wavesoldering or reflow problem ? Check the difference between the boards that show this symptom and those that doesn�t. Are there differences in the material, the handling, the processes, pitches etc. Looking at that should help you

GSM Bump Process

Electronics Forum | Wed Jul 14 05:54:57 EDT 1999 | Larry Jeter

I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful

Re: smt component id

Electronics Forum | Tue Jan 13 10:53:05 EST 1998 | Tonya Warner

It is also my job to ID and cross components. I have found that the same number can be used by different manufacturers for different parts, same package style. There is not a standard marking system for SMT devices so watch out for this.

Fuji CP6 5000

Electronics Forum | Mon Jan 21 08:47:36 EST 2002 | pr

The nozzle shafts are different (and windmill/ head), cutter blades and assy. are different, that's all I can think of off the top of my head. Also slightly slower than a CP64. I believe the 65 and 65000 are the same.

aoi

Electronics Forum | Fri Sep 20 13:02:23 EDT 2002 | Howie Budovsky

If you have the time look at VI. You should see a difference. They go about it in a much different way. It is well worth your time


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