Electronics Forum | Thu Jan 09 10:47:36 EST 2003 | Hussman
Depends on what you mean by shifting towards each other. Otherwise, 7 mil should be fine for 0603. I've used 6mil, 7mil and 8 mil without problems. Generally, stencil thickness won't have a bearing on "shifting" parts. Check placement. Make su
Electronics Forum | Thu Jan 09 16:42:50 EST 2003 | russ
what are your grading criterias? All of these work pretty good but have differences in the "bells and whistles" I like the Air-Vac DRS24 (no exp. with the 22) because of the large under heater and thermo-couple control. but it is very slow and costl
Electronics Forum | Fri Jan 17 15:36:23 EST 2003 | davef
How do 0.5 mm pads on the board help paste release from the stencil? Paste release from the stencil is a function of: * Paste * Printer operation * Stencil design You have no obligation to made your stencil apertures the same size as the pads on yo
Electronics Forum | Fri Jan 17 21:17:18 EST 2003 | Grant Petty
Hi, Our paste release problems have been solved, and we worked on the stencil, and things are working well now. However this board was designed before we knew what was going on, and we thought a little more size on the pads would be a big help. Is
Electronics Forum | Wed Jan 22 13:17:48 EST 2003 | slthomas
We're considering stenciling SMT adhesive to increase throughput. This is an as-of-yet unproven process and for that matter pcb design (we've never done anything with more than about 50 SMT parts on the bottom, this board has in excess of 1200, but
Electronics Forum | Fri Jan 24 17:05:17 EST 2003 | Hoss67
DDave, I do not have the benefit of having the old machine here for comparison unfortunately. Comparing topside wetting to old sample boards run on the older machine show similar results. No solder balls. I have a thermal profiler and have run ma
Electronics Forum | Fri Jan 24 22:50:51 EST 2003 | MA/NY DDave
Hi Again Distance is tough, besides far less exciting.. You got the panther at your breast, screaming!! Somehow you have to make this go the other way. Rather than solder flowing any old place it wants to, when it wants to. Chasing the heat, Chasi
Electronics Forum | Wed Jan 29 14:22:56 EST 2003 | russ
Most bowing I see is caused by an asymetrical layer stackup of the PCB. (different copper thicknesses throughout the stackup) e.g. for a 4 layer board - 2 oz. copper on layer 1, 1 oz. copper on layer 4, etc... I would doubt that is the V-score since
Electronics Forum | Thu Feb 06 09:53:38 EST 2003 | genny
Actually, the most common reason I have seen vias in pads is for grounds in RF applications where the frequencies are high enough that you need a ground RIGHT THERE!... not .1" away. Vias and traces have RF properties of capacitance and inductance,
Electronics Forum | Thu Mar 20 14:31:27 EST 2003 | russ
I totally agree with Dave! How long does diplomacy take? Was it the US that had "total diplomatic failure" OR the French who made sure that any deadline date of the 13 yr. old resolution would get vetoed? So, Saddaam needs a break and more time? I
