Electronics Forum: dimm and bent (Page 1 of 2)

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

memory module conveyor belt and stacker

Electronics Forum | Tue Jan 05 21:01:40 EST 2021 | brianjones

We are looking at setting up a memory module conveyor belt with a stacker and de-stacker. I will need to handle DDR3 and DDR4 Long DIMM and SODIMM. I will be mounting an image camera under and over the modules. Looks like an edge conveyor would be be

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 23:26:46 EST 2005 | timekey

Of course a new machine out of the box should perform at a realistic Sigma level and it's not unfair to hold a machine manufacturer true to their claims. However, even if a new machine does meet the criteria on day 1, the numbers will be constantly c

AOI selection,specifically ViTechnology and Mirtec

Electronics Forum | Wed Jul 19 20:28:49 EDT 2006 | mrduckmann2000

We recently purchased a Mirtec AOI machine, it take a bit to program but overall we are pleased. The machine has a downward looking camera, we have had some issues with the machine not catching opens. When a IC has it's legs bent straight up off th

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef

I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan

Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw

Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.

Mydata (MY12) error-Frame Grab and Light Curtain

Electronics Forum | Fri Sep 25 13:09:42 EDT 2009 | rmitchell

Thanks to those that responded. I eliminated the light curtain problem. The metal plate the light curtain pcb bolts to was bent. I had it aligned in our machine shop and it worked properly. I forgot to mention the error was pooping up with no fee

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan

thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod

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