Electronics Forum | Thu Jun 04 19:53:44 EDT 2009 | davef
For low volume work and repair, just use a brush dipped in tacky flux to apply flux to the ball array.
Electronics Forum | Mon Jun 01 21:40:18 EDT 2009 | kircchoffs
i need some inputs regarding this process. is this really eliminates voids and other solderability issues on BGA's?
Electronics Forum | Tue Jun 02 07:31:55 EDT 2009 | scottp
Early on when we started looking at BGAs we tried dipping. We've done it in production for a couple decades with flipchips. Dip fluxing BGAs worked fine in the lab but we ended up starting production with screen printed flux for cycle time reasons.
Electronics Forum | Tue Jun 02 21:13:08 EDT 2009 | kircchoffs
thanks for the inputs. we are planning to run on fuji nxt i think cycle time will not be an issue. i still have another question if we can still use the same reflow profile for paste? or do we need to create another profile?
Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe
We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you
Electronics Forum | Mon Jun 15 15:33:51 EDT 2009 | hegemon
IMHO I would suggest that if you are using flux only during a BGA placement on a small run, that you first tin the pads with your soldering iron, then level the pads back out with wick. Accomplishes two things; adds a little metal to the joint to ma
Electronics Forum | Tue Jun 16 14:46:25 EDT 2009 | grantp
Hi, If your using NXT to place these BGA's then you must be doing large runs. BGA's are the most easy part to place, and don't worry about them. Just stencil paste down for them as any other component. But we use 1:1 reduction on our stencil, so we
Electronics Forum | Thu Apr 09 12:13:22 EDT 1998 | raymond
What is the pro & con of using flux dispensing vs flux dipping method for flip chip assembly ?
Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
