Electronics Forum | Wed Aug 25 09:53:40 EDT 1999 | lwk
| | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | Most common reason is uneven heating where
Electronics Forum | Wed Aug 25 15:47:25 EDT 1999 | JohnW
| | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | Most common reason is uneven hea
Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Aug 25 21:44:03 EDT 1999 | Jason Tomlinson
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Aug 04 16:43:58 EDT 1999 | John Thorup
| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t
Electronics Forum | Mon Jun 14 09:23:57 EDT 1999 | C.K.
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Thu Jun 17 10:25:43 EDT 1999 | Brian Wycoff
| | We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centr
Electronics Forum | Wed Jun 09 15:54:16 EDT 1999 | Glenn Robertson
| | Does anyone have thoughts on BGA rework. We now use the OK BGA 3000 and now am considering an Infrared machine. Any thoughts? | | | I've used Pace, Conceptronic and, now, SRT machines. Bottom side IR is OK. Better thermal balance is achieved wit
Electronics Forum | Thu Apr 22 14:31:39 EDT 1999 | Dave F
Michael: Two things: 1. Profile: A. Your FR4 profile will not produce good solder connections on your ceramic substrate. Hey wait a minute, you soldered FR4 at 250C?? Ceramic is a themal sponge. You'll need to play, but it should be easy compare
Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
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