Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Fri Dec 03 12:45:28 EST 1999 | Bill
I'd like to print out a forum item to fax to a friend who does not have internet access or email yet at his new facility, but no matter what I do to my printer set-up I cannot get the full page width to print. The right side of the message keeps gett
Electronics Forum | Wed Nov 17 03:58:18 EST 1999 | Bach Huss
Hi we are running S-15 here and the LED for the component camera is not all bringht at the same brightness level. This cause us to use different .gf for our standard component. It is hard to ballance the illumination level between machines. Does a
Electronics Forum | Tue Nov 16 19:53:24 EST 1999 | Chris
Does anyone know sources for vertical cure ovens. I remember seeing several add years ago but appears the subject has lessened. I know Heller makes a couple of them. I remember Blue M making one too. All I find now is Heller. Also what other adv
Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Thu Oct 28 13:36:14 EDT 1999 | Bart Smith
I am a design engineer and have a circuit board design with a 292 pin BGA on it. The board manufacturer is experiencing a failure rate of about 2.8% on the BGA device due to soldering problems. This is my first experience with BGA. How does the 2.
Electronics Forum | Tue Oct 26 11:22:45 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating th
Electronics Forum | Tue Oct 26 11:15:55 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating the
Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William
I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a
Electronics Forum | Mon Oct 25 21:28:38 EDT 1999 | Dave F
3%) concentrations of gold form brittle intermetallic compounds with the tin in your solder. Electroless gold is applied with an autocatalytic process that self-limits around 5 mils thickness. You're correct electrolytic gold is used for goldfinger
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