Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Thu Sep 12 08:22:30 EDT 2002 | caldon
YOU think I could let this posting go by with out a reply??? PLEEEEASE. Genny- No matter what direction you go do your home work. This will require a lot of home work on you and your staff. If you go the contract manufacturing route GREAT!!! But hav
Electronics Forum | Fri Oct 18 09:50:02 EDT 2002 | russ
Steve, I am not aware of any standards so to speak. But IPC 782 and 770 have some useful info regarding mounting and pad geometries for wave etc... Since I do not know what type of components you will be wave soldering I will just give you some
Electronics Forum | Mon Oct 14 15:04:37 EDT 2002 | seand
Hello Everyone, Sticking to issues of this discussion: I think Dave brings up a valid point about sales reps indicating other competitors in their strands and responses. Personally, I feel this is a tricky issue and has not so much to do with the
Electronics Forum | Thu Apr 10 05:25:43 EDT 2003 | dst
Hi, My company is currently experiencing a high feild failure rate on a 100nF chip ceramic that we use in various applications across our product range. One of them being de-coupling which means we use millions of this device every month. The failu
Electronics Forum | Tue Jun 10 01:09:37 EDT 2003 | iman
Hi! Thanks to you as the first replier! I do admit it "narrows" the information channels feedback flow by keeping this thread reply limited to "non-commercial" engineering folks, but I already have lotsa war stories from the salesmen around this reg
Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef
First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c
Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken
There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
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