Electronics Forum: don (Page 1 of 748)

Cleanroom Basics

Electronics Forum | Thu Jun 23 11:43:37 EDT 2005 | jdengler

As Dave states: Don't let any people in the room Don't unpack or pack anything in the room Don't let any material enter the room This should keep the room clean.

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef

Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o

Loctite Adhesive Viscosity

Electronics Forum | Tue May 15 13:45:19 EDT 2001 | John

I don't think the syringe pressure has been adjusted, but I'll watch over the next few days to see if it changes (by itself of course). We don't control the humidity in our plant and don't really track it. However, there have been some significant

BGA/Fine pitch footprints

Electronics Forum | Thu Mar 04 20:15:51 EST 2004 | davef

Print paste in the holes you don't plan to use and let it dry. That way you don't affect your paste volume in other apertures. The bad news: When you don't want paste to dry and close your apertures, it will do it. When you want paste to dry and

MYDATA vs ASSEMBLEON

Electronics Forum | Wed May 25 02:58:04 EDT 2005 | Jose Luis

Hi Aramis. I don't understood you....Do you think that in this moment, I didn't contact with every provider of every machine...??? I try, because I think that this forum is for this, to collect the experiences of users like me, but, please, don�t do

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas

We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss

PIHR... what do you think...?

Electronics Forum | Thu Jun 12 11:11:45 EDT 2014 | emeto

What you need here is a double print process. You should have 5mil stencil for SMT followed by a 10-15mil stencil for TH. I don't know what quantities you are running or do you have the capability to add another printer in the line, but that would be

IET Wave Solder

Electronics Forum | Tue Aug 30 07:41:52 EDT 2005 | tm

don know

IET Wave Solder

Electronics Forum | Tue Aug 30 07:41:56 EDT 2005 | tm

don know

MSL Project

Electronics Forum | Fri Mar 23 08:46:09 EDT 2012 | rwyman

I think you need some new suppliers. Any reputable supplier will have the M-code marked on the outside of the pkg, as that's a req't of J-STD-033. So if it ain't there, tell them they need to properly mark the pkg. Them telling you to "check the i

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