Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Mon Aug 31 07:56:39 EDT 2009 | d0min0
Hello, since some days we are facing strange problem with SMT component reflow paste on one side of the component is reflowed correctly while the other side is 10%-70% non-reflowed (same component on 3 positions per module, alwyas the same land pad)
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
Electronics Forum | Thu Mar 02 09:45:24 EST 2000 | Jacqueline Coia
Could this QFP be easily wave soldered if placed on solder side of PCB, if so are there two different footprint formulas that take both wavesoldering and reflow into consideration. Thanks again. Jack
Electronics Forum | Fri Apr 28 09:36:56 EDT 2000 | Rick Landry
Can someone tell me the recommended via size for a .093" thick pcb. Bd is 6 layers, smt components on top side only and thru hole components.
Electronics Forum | Thu Mar 02 09:45:24 EST 2000 | Jacqueline Coia
Could this QFP be easily wave soldered if placed on solder side of PCB, if so are there two different footprint formulas that take both wavesoldering and reflow into consideration. Thanks again. Jack
Electronics Forum | Mon Apr 09 10:38:26 EDT 2001 | bobbemc
Design parameters are based on tallest components on the bottom side of the PCB. The smallet the component the thinner the floor thickness can be.
Electronics Forum | Thu Jul 20 14:46:00 EDT 2000 | Jeanette
All the sources of information that I have read so far mentions PTH boards, has this process been tried with single sided PCB's? If it has what were the results.
Electronics Forum | Wed Jun 09 11:38:20 EDT 1999 | Roseann
In past PCB designs I have cleared all traces from all layers (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?
Electronics Forum | Sun Nov 15 23:40:59 EST 1998 | emori
Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.
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