Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF
This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold
Electronics Forum | Thu Jan 16 03:43:42 EST 2003 | johnw
1st off for the forum folk, I don't like the fact that the new system only let's you see the posting your replying too, I'd rather be able to see the thread..... Anyhoo, why this alloy?, it's because it's the device manufacturers preferred and the c
Electronics Forum | Thu Jan 23 20:27:54 EST 2003 | joeherz
Hello, We recently installed a new/used UPK 650 fitted with a foam fluxer using an RMA flux chemistry. We have had problems with icicling and bridging from the beginning. The bridging occurs mostly on DIPs and connectors. The icicling is on longer
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Wed Sep 15 23:15:55 EDT 2004 | pdeuel
Im with Pete, Zero defects. We have high defect rate for many reasons. No line tech, operators set up and run then when QA reports defects engneers are called. Not to make people mad but our process engneers are lacking practical experance to fix pro
Electronics Forum | Wed May 18 14:58:05 EDT 2005 | splice
Hi, I am having some PTH non wetting issues. Setup and chronology of events is explained: Set Up; Part: 1 MM pitch connector 378 pins Solder: Kester Ultra Pure 63/37 solder Pot; 250 C pre heat; Peak 94C top side Flux: Qualitek 775, Fluxer: foam T
Electronics Forum | Wed Aug 24 10:07:56 EDT 2005 | stepheniii
I think where the fuzzy thinking starts is by calling the recipe's; profiles. Or maybe I"m being too fussy. Idealy you want every solder joint to have the same thermal "profile" (not recipe). That is the temperature over time is best if identical fo
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