Electronics Forum: downs (Page 351 of 464)

Leadless Leadframe Part Manufacture Issues

Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef

What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked

Wanted: Impact sensor in roll form for Pick & Place SMT usage...

Electronics Forum | Wed Jun 20 18:32:35 EDT 2001 | davef

I'm sorry, I can�t image on your words. A couple of years ago, we had a rash of DOA shipments to a customer. We thought someone could be drop-kicking the packaged product down the stairs. So, we shipped with BIG red labels and impact indicators on

Screen Printing with a Pallet.

Electronics Forum | Thu Jul 12 21:41:35 EDT 2001 | mugen

A) Questions: 1) What sort of pallet materials used? 2) what PCB thickness & LxW size? 3) what stencil type & thickness used? 4) what profile type used (peak deg-C)? 5) any peak Deg-C contraints for the components SMT onto the PCB? B) We use pallet

Warp PCBA- how to repair ** Question #1

Electronics Forum | Mon Jul 16 21:39:40 EDT 2001 | davef

The method you suggest is about the only way to �clean-up� this terrible situation. Realistically, this is a "memory" type condition induced by design, build symmetry, "cross ply construction", excessive cool down rates during lamination or reflow a

Solder Paste

Electronics Forum | Thu Jul 26 13:17:45 EDT 2001 | Hussman

Most solder paste manufacturers will take a reasonable amount of paste back, just so they won't loose your business due to bad paste. But if you're asking to ask to ask - separated paste from flux is not a bad thing if the jar was never opened. Pas

Re: Moisture sensitive Devices

Electronics Forum | Wed Feb 09 21:33:32 EST 2000 | Dave F

Ashok: I have three answers to your questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opene

Re: Anti-solder finishing

Electronics Forum | Mon Feb 07 13:26:14 EST 2000 | Dave F

Spacerwoman: Carol is a professional spacer problem fighter (we think). When people have problems with spacers, they call on SPACERWOMAN!!!!! Here she is to save the day � ;-) Selecting a spacer made of brass is a good choice for many applicatio

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 07:55:07 EST 2000 | Pat Pepper

Hi Wolfgang, Thanks for the response. We had a similar situation to yours with some white tin samples that sat around for about eight months. Samples soldered right after they arrived soldered better than the ones we soldered eight months down the

Re: PTH connectors mounted on SMD process

Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.

When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc

Wave soldering vertical mini-dins

Electronics Forum | Mon Nov 08 09:45:29 EST 1999 | John Burris

Having a big problem waving these puppies, hope someone can help. I've got an 8 pin mini-din connector (like a PS/2 connector with two more pins) that has two mounting pins on each side. During wave, at least half the lot has shorts from the ground p


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