Electronics Forum: downs (Page 441 of 462)

Re: Lost Components

Electronics Forum | Mon Apr 13 16:37:26 EDT 1998 | Steve Gregory

| Wondering if anyone has information on percentage of components that we | can expect to "lose" during our SMT process. We are new to SMT, using | QUAD machines and feel we are losing to many parts during our process. | We are spending a lot of tou

Re: Why is The Forum so slow now?

Electronics Forum | Tue Mar 17 11:32:35 EST 1998 | Earl Moon

| | Children, | | Let's stop the squabbling. SMTNET is here for us to use. It may run slower but it is still a very effective and necessary tool. It's amazing, as we progress further into the information age, we become spoiled and frustrated about

Re: Screen printing the board from........

Electronics Forum | Thu Mar 05 13:17:19 EST 1998 | Justin Medernach

| Hello everyone! | Does any know anything about bare board size variations? | Is there a spec. or tolerance? | I'm running small lots of boards and during the screen printing process | I find that I cannot paste each board perfectly.I've tried other

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef

1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use

Board Cleaning

Electronics Forum | Wed Dec 05 17:48:58 EST 2001 | Mike Konrad

There are a few good de-fluxing chemicals and many more �not-so-good� de-fluxing chemicals. As a manufacturer of cleaning equipment, it is imperative that our customers use a de-fluxing chemical that: #1: Removes flux #2: Is environmentally safe

Reflow Oven Calibration

Electronics Forum | Wed Mar 06 21:17:35 EST 2002 | davef

One, has anyone else ever experienced and dealt with a company debate regarding whether or not your reflow ovens should or should not be calibrated? Sure, it�s an excellent debating topic. We argue about stuff like this all the time. See, somebody

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

Tenting via(s) under BGA & CSP?

Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef

First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate

Help SMTnet with new feature

Electronics Forum | Mon Apr 22 14:21:50 EDT 2002 | bdoyle

Hello Everyone! I'm sure everybody is curious about what we're up to every day. Well in an effort to improve the site for all of our users we're currently working on a pretty big feature. This feature comes as an answer to the countless emails we

Sn/Pb diffusion

Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef

Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over


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