Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy
Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve
Electronics Forum | Wed Jan 03 21:20:22 EST 2007 | davef
Comments are: * General purpose RTV (RTV-108) releases an acetic acid (vinegar) during cure and corrodes copper, brass and sensitive metals. It is therefore NOT for use in delicate electrical or electronic applications. However, there is an electrica
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
Electronics Forum | Fri Mar 11 18:47:54 EST 2005 | davef
JD: It's important to note that FR-4 does not contain PBB or PBDE. The bromine in FR-4 epoxy comes in the form of tetra-bromo-bisphenol A [TBBA], which polymerizes and become part of the cross-linked epoxy. Bromine, in the form of hydrogen bromide, i
Electronics Forum | Mon Jul 12 21:05:06 EDT 1999 | karlin
Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Secondly, I need also facing a lo
Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Thu Apr 21 17:22:29 EDT 2005 | davef
We prefer epoxy.
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter
I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T
