Electronics Forum: dpak stencil (Page 1 of 2)

Re: D Pak stencil apertures

Electronics Forum | Fri Dec 10 10:25:59 EST 1999 | Wolfgang Busko

Hi Larry, you might find something looking for the thread "D-Pak misalignment Problem - Kantesh Doss 23:43:23 12/02/1999" Good luck Wolfgang

Adhesive printing thin plastic- vs. metal stencil

Electronics Forum | Wed Apr 17 02:30:03 EDT 2002 | seje

Hello. There is been a lot of talk about thick plastic stencils vs. metal stencils for adhesive printing, but how about thin plastic stencils? We used to use a very thin plastic stencil (from loctite) with printgap (=snap-off) to adhesive printing

D-Pak misalignment Problem

Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss

We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve

Re: D-Pak misalignment Problem

Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss

Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb

Skewed components

Electronics Forum | Thu Mar 08 14:30:45 EST 2007 | ratsalad

If you are in the middle of a run and can't get a replacement stencil there immediately, you can always put a little kapton tape on the bottom of the stencil to mask off a portion of the DPAK pad and reduce the paste deposit. We have had to do this

SMT Stencil Aperatures

Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099

Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron

Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad

Aperture shape for DPAK

Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto

Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:42:18 EST 1999 | Chris McDonald

Just as explained in a follow-up you are getting too much paste on the pad. The pad is probably the right size but you cant have your aperature the same size as your pad. What we have done is put a Cross in the stencil. This will reduce the paste and

Stencil design for dpack

Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink

We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance

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