Electronics Forum: electron (Page 5776 of 7929)

tape splicing pros and cons

Electronics Forum | Tue Sep 20 16:19:44 EDT 2005 | gregp

Hello all, I am looking for a general opinion on splicing tapes. It has always been my opinion that splicing was an after thought for the machines that did not allow feeder removal and replacement during machine operation. If the machine has the ab

tape splicing pros and cons

Electronics Forum | Thu Sep 22 08:06:13 EDT 2005 | gregp

Hello Rob, We have reel hangers on our feeders as opposed to "buckets". The reels cannot be removed while the feeder is mounted to the machine. Thus splicing is not currently an option. As mentioned above, we felt that it is easier to remove the f

tape splicing pros and cons

Electronics Forum | Fri Jun 16 00:45:19 EDT 2006 | Richard Robins-Bird

Not all splicing tapes require the use of specialist tooling or splicing plates to make a join. Please see wwww.fujismt.com where a complete range of SMT splicing tapes (Joint Tapes) can be found for use with chip mounters such as Assembleon, Europla

tape splicing pros and cons

Electronics Forum | Fri Jun 23 12:17:11 EDT 2006 | kevindebarra

Dear Greg and PWH, I see from your comments above, that you are still unsure whether splicing is for you, and mention that you have yet to find a "good splice tool." QTEK Manufacturing Ltd. based in Ireland, Mexico and Hungary provide a unique tool

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS

IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa

High Mix Low Volume : Beck End Floor Loading

Electronics Forum | Wed Sep 21 05:33:34 EDT 2005 | Selva Govind

It's me again I post it before complete the message. Let me start once again. I plan, schedule and deliver SMT production programs for HMLV plant(app 1200 Assemblies). The kind of floor loading I have here is works great for SMT only. I'm considering

caps moving from pads

Electronics Forum | Wed Sep 21 18:09:03 EDT 2005 | PWH

We've had parts jump off pads on occasion due to panels or boards that are restricted in a carrier during reflow. The boards/panels expand and the restriction causes them to warp thus popping parts around during cool down. Doesn't sound like your p

caps moving from pads

Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth

I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the

MSD Control

Electronics Forum | Thu Sep 22 06:54:14 EDT 2005 | Rob

Hi Gavin, Depends on what MSD class, but in general for the more sensitive parts if they've been opened & not used within the time limit it's rebake, add dessicant & seal. Our distribution side splits them down into more manageable/production size

Universal GSM1 with Shuttle

Electronics Forum | Thu Sep 22 18:15:51 EDT 2005 | PWH

Does anyone have experience using a shuttle on a GSM platform? I'm just wondering how well it works and how reliable and trouble free the component picks are. I am looking to run a low volume line with a printer/oven and a GSM1 platform with a PTF


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