Electronics Forum | Thu Jun 20 05:09:41 EDT 2002 | mattiasw
I am running a VisionPoint AOI equip. from DiagnoSYS, and I have a question regarding the calibration of brightness on the cameras. When I run system Calibration to check the camra brightness I should have the following values: Cam#1=126 Cam#2=126
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Mon Jun 24 18:45:06 EDT 2002 | jersbo
I have done experiments on small runs, with a few connectors and have had favorable results, I had apertures (oversized)made for the thru-hole connectors on our SMT stencil and hand inserted the connectors.. A few insufficient solders here and there
Electronics Forum | Tue Jun 25 05:28:45 EDT 2002 | ianchan
Vapour Phase is a "phased out" technology. Hot Air Convection is the commonly acceptable type of Reflow Oven. Some folks are getting good improvements for "IR + Hot Air Convection" (combined) Oven technology. Nitrogen Ovens have their own set of p
Electronics Forum | Tue Jun 25 11:26:11 EDT 2002 | pdt203
Sometimes when a customer has sent parts on reel without any leader, we will take out the first 5-8 parts and then tie off the cover tape with some leftover tape from the last run. We keep those parts we removed and then place them back in the feede
Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef
I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Wed Jun 26 01:01:24 EDT 2002 | ianchan
Steve, Dason has valid points here. dun listen to what supplier's say about paste lying on the PCB pads able to be exposed at ambient temperatures for 8-24 hrs? that will never get approval for Class-3 type of customer auditors. (Would any serious
Electronics Forum | Wed Jun 26 11:29:53 EDT 2002 | slthomas
Go to the top of the page and enter your topic in the "Search SMTnet" window. It can take some tweaking to get it dialed in to the exact topic you want. Do you mean the paste was on site for 3 weeks, or was it actually out of the fridge for 3 week
Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan
Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr
