Electronics Forum | Wed Dec 15 18:03:28 EST 2004 | russ
I have used both 4 and 5 mil stencils for 10 mil round apertures. We don't have volume measurement capability but we measure height and the 4 mil appeared to have more paste and better uniformity from a visual standpoint than the 5 mil. The unfortu
Electronics Forum | Fri Dec 17 08:05:00 EST 2004 | davef
Your solder paste is talking to you, follow its message. Listen to the paste. Be at one with the paste. If you insist on ignoring the message of the paste, add more paste, if you just need to complete the last board or so, but you really should ju
Electronics Forum | Tue Dec 21 11:46:29 EST 2004 | KEN
Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my mind, is an unacceptable technique. Why? 1. Can not control metals content. 2. Probably not adding the same chemestry flux...as paste flux has many different addi
Electronics Forum | Wed Dec 22 18:09:07 EST 2004 | kmorris
At a previous job I had been taught that when reflow soldering polyimide flex circuits, it was necessary to pre-bake them before reflow soldering to prevent delamination. Our procedures said that there must be a 1hr bake prior to reflow, and the flex
Electronics Forum | Wed Jan 05 10:55:12 EST 2005 | OverTheHill
WOW Sr.Tech, 40K worth of bent tools? I'm about ready to be sh*t canned because of 1K's worth. As for trimming the mags, the product is running fine (many boards) and then out of nowhere the tool bends, so I assume my PERFECT operators trimmed the ma
Electronics Forum | Mon Dec 27 13:26:47 EST 2004 | HOSS
Need some feedback here. We're running a foam fluxer using WS chemistry (AIM 715M). We have been running almost exclusively .062 and a few .093" PCBs but we've recently started running some boards that are .100 and .125 thickness and are having tro
Electronics Forum | Tue Dec 28 21:51:04 EST 2004 | KEN
When using a foam fluxer: 1. Bubble size is important. What stones are you using? Ever clean them? Too large a bubble will NOT help your situation. (I forget bubble size range....check with your fluxer mfgr.) 2. Thinner will help in capilary m
Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J
One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have
Electronics Forum | Tue Jan 04 10:00:19 EST 2005 | Carmichael
No mystery there... The balls are reflowed by conduction of heat from the package itself and the backside preheater just as in any other rework machine. The laser is just another method of precisely heating the entire package. The advantage is overa
Electronics Forum | Thu Jan 06 21:41:20 EST 2005 | James Khor
You can using Ersa IR550A Rework System. The unit was NOT using any hot air process. IR550A Rework System is worldwide the only system with a genuine closed loop control system. Which employs the current temperature at the component in order to regul
