Electronics Forum: electronic assembly (Page 251 of 598)

Oxygen Levels in Lead-Free Reflow

Electronics Forum | Tue Oct 15 13:40:23 EDT 2002 | greenman

I'm currently trying to get a feel for what oxygen level I will need in my lead-free assembly process. Do I need to go with the pure vaporized liquid nitrogen, or can I get away with one of the other "on-demand" operations? All assistance gratefully

Thru-Hole Equipment

Electronics Forum | Tue Oct 22 09:43:29 EDT 2002 | jrloudenjr

I am an EMS provider building mixed technology assemblies. We are currently using Universal Multi Mod and VCD machines for our auotomated thru-hole. These are the 20 year old technology machines and I am investigating alternative pieces of equipmen

Warranty on Prototype boards

Electronics Forum | Thu Oct 24 09:22:32 EDT 2002 | dscott

We are a supplier building prototypes. Most of our projects consist of boards with array packages down to 30 mil pitch. My concern is with customers that return boards for rework on array packages. Typically if their product is not functioning that i

Handling PCB assy's

Electronics Forum | Mon Nov 04 14:45:01 EST 2002 | erikb

As a rule handling PCB's with bare hands is acceptable provided that there is sufficient esd protection as well. It is a good rule of thumb however to provide your inspectors or assembly people with finger cots or cotton gloves to keep the product cl

Cost estimating for benchmarking

Electronics Forum | Tue Nov 12 13:23:21 EST 2002 | Sergio Vito

Hello Sirs, I would really appreciate if somebody could help me to understand how these elements of cost bellow can affect the total cost of an SMT facility. I am studying these numbers for benchmarking purposes. 1) Equipment amortization 2) Maint

Reflective coating on PCB

Electronics Forum | Wed Nov 20 16:40:32 EST 2002 | csimfgeng

Sign makers utilize a material called "Scotch-Cal" and "Scotch-Brite" in making decals used in outdoor environments. Material similar to this comes in metallic silver and gold. Pieces of this can be economically die-cut and affixed to your PC Board

Board with immersion Tin

Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef

Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm

SMT Assembly over Flexible PCB

Electronics Forum | Fri Dec 06 09:47:31 EST 2002 | Claude_Couture

Printing: use rigid carrier plate to hold and support your flexible PCB. tooling holes in PCB to position on the plate, two-sided tape to hold PCB in place. Oven: same carrier plate, use capton tape or clamps to hold PCB in place. I believe some in

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple

Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Thu Dec 05 22:46:39 EST 2002 | davef

While J-STD-001 specifies an upper limit for acceptance of assembly, we use Resistivity Of Solvent Extract testing as a process control. In truth, this "LT 10.07 �gm/sg in NaCl equivalent" measurement has substantial limitations, not the least of wh


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