Electronics Forum | Tue Apr 11 20:23:19 EDT 2000 | Dave F
Ashok: You're still goin' down that ol' ESD road aren't ya bud? Why do you need the boards to be dry? Conformal coating? Hey wait a minute, are you one of those no-clean people? Er zis related to the Kapton tape res fandango? Anywho, be careful
Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca
All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after
Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
Electronics Forum | Mon Mar 20 19:27:14 EST 2000 | Marc Ruggiero
Hello, I am looking for inputs (experiential or opinions) concerning field reliability of high-frequency RF boards that have had a trace or pad repair (or both), any package type. If anyone can comment on this subject, I would appreciate it. We bu
Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ
Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these
Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko
Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F
Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
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