Electronics Forum | Tue Sep 26 00:42:36 EDT 2006 | fctassembly
Hello Brad, I think Greg is a mind reader!! Thanks for the opportunity to give an update to the forum on SN100CL Lead Free HASL. Conversions to SN100CL HASL is occuring at a rapid pace worldwide. As of July 2006, there were over 250 HASL machines ru
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Tue Oct 24 08:07:42 EDT 2006 | markb
We are experiencing an issue with RoHS boards delaminating during SMT. In tyring to determine root cause, our board mfg house states the issue is with the laminate. The laminate supplier states that the board house is not taking the proper precua
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Tue Oct 31 21:49:38 EST 2006 | davef
First, we assume the white residue is only on the connector and not on other components. That would imply that either: * White stuff was on the connector when it came in-house from your supplier. [Confirm this theory by baking some connectors from
Electronics Forum | Thu Nov 02 15:46:43 EST 2006 | rgduval
I'm looking for some information on soldering irons being used in my no-lead process. Specifically, my floor seem to be burning out tips at an alarming rate, when soldering lead-free assemblies. Today, I had one woman burn out a brand new tip in 4
Electronics Forum | Sat Nov 11 11:27:51 EST 2006 | Tom
Hi, "glass wicking failure" we don't know what this is, but we suspect that the reflow process could very well be the root cause for some of our pcba with micro vias failure. Micro vias pcb we know to well (we don't like them at all). There are No p
Electronics Forum | Wed Nov 08 08:48:45 EST 2006 | markhoch
Okay, here's the deal-e-o....I need to find the Nation's Best BGA Rework Specialists. I have 50 PCBs each measuring about one square inch, that need to have a BGA Ring Socket Removed, eight capacitors removed, and a new ring socket installed. Sounds
Electronics Forum | Fri Nov 10 17:49:24 EST 2006 | rgduval
No, not exactly. It's sort of a one board wave/pot assembly. Looks like you put a board in the chamber, it has programmed preheats etc, and when the preheat time has been reached, the solder is raised up to the board, the board is soldered and the
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