Electronics Forum: electronic (Page 1921 of 7929)

Small blister, solder mask

Electronics Forum | Mon Jun 28 22:30:06 EDT 2004 | davef

If you find it at the end of your process and you find no defects, work on something else. Now if you are a smooth talker and seek a little adventure in life, you might be able to finesse this thing into a road trip to take a tour of your board fa

Dispensing Paste for 0201-0402 uBGA devices?

Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob

The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.

Dispensing Paste for 0201-0402 uBGA devices?

Electronics Forum | Thu Jun 24 10:53:07 EDT 2004 | deonn

Dear Rob, Thank you for your participation. However, the question is in regards to dispensing via automated dispenser (e.g. CAMALOT, PVA, etc..) not printing with a stencil. Thank you for your attempt. Deon

Moisture Sensitivity Level 2 Component Baking

Electronics Forum | Tue Jun 29 10:49:07 EDT 2004 | kennyg

I agree that this is the the thing to do. I just thought it was strange that 033A does not mention drying level 2 parts. I wonder if it was intentional or an oversight.

Moisture Sensitivity Level 2 Component Baking

Electronics Forum | Tue Jun 29 10:56:37 EDT 2004 | davef

It's a reasonable question. Maybe Francois Monette (fmonette@cogiscan.com) will join-in. I believe he's on the 033 committee. [Kenny G: By the way, I bought a couple of your albums in the mid-1980s. Very innovative stuff, at the time.]

Moisture Sensitivity Level 2 Component Baking

Electronics Forum | Tue Jun 29 14:33:49 EDT 2004 | fmonette

This is an active item of discussion for the upcoming revision of J-STD-033. Most likely the bake table 4-1 will be modified to include guidelines for level 2 components. Francois Monette Cogiscan Inc.

Solder balls

Electronics Forum | Fri Jul 02 17:08:58 EDT 2004 | blnorman

We used to use Alpha paste. Every summer we had solder ball problems when the humidity rose. Time frame sounds like this is something to check in to.

Solder balls

Electronics Forum | Sat Jul 03 02:13:01 EDT 2004 | yukim

The manufacturer says that since this solder paste has synthetic flux (not natural rosin) it is sensible to humidity. Worked with reflow profiles, but no remarkable improvements. We are changing solder paste every 2 hours.

Solder balls

Electronics Forum | Tue Jul 06 08:10:34 EDT 2004 | yukim

The manufacturer confirmed that it is humidity - the solder paste is too sensible to humidity. Now I tried Koki solder paste with good result. But, it does leave flux residue in good quantity. Does anyone have experience with Koki solder paste?

Solder balls

Electronics Forum | Wed Jul 07 02:20:48 EDT 2004 | Koki

Please let me know exactly the Koki specification that has managed to solve the balling issue and we can look at the level of residue or the cosmetic may be what you wish to improve.


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