Electronics Forum: electronic (Page 2479 of 7894)

BGA Tilt

Electronics Forum | Fri Feb 09 08:45:31 EST 2007 | russ

Most likely either profile or I was thinking a cap! resistors are to thin to make the part stand up hehehe just a joke. Do not follow the advice of weighting part, that is ridiculous, poster of that, if you have never done BGA before please do not

solder paste ingredients and their effects

Electronics Forum | Fri Feb 09 12:31:35 EST 2007 | realchunks

Ask Brain Toleno at "circuitsassembly.com/blog" He's a smart guy and works as team lead at Henkel Loctite. Just don't take him out for drinks.

EPROM OR OTP ICs issues

Electronics Forum | Fri Feb 09 14:29:20 EST 2007 | dphilbrick

No, Muhammad is preparing for some type of trial, either a legal one or one by fire! These rank right up there on the absurdity scale. Got to be one or the other.

Solder joint cleanliness

Electronics Forum | Fri Feb 09 09:23:12 EST 2007 | Adam

Hi Would anyone the what the solderjoint cleanliness requriements are, on an assembly which will eventually be operating in a vacuum environment ? Thanks in advance Adam

Solder joint cleanliness

Electronics Forum | Fri Feb 09 12:28:16 EST 2007 | Snirk Prichards

Me thinks you is on to something. I like day way you tinks and would like to bring to honda plant.

Solder joint cleanliness

Electronics Forum | Sat Feb 10 09:29:08 EST 2007 | davef

NASA requirements may be a good starting point http://www.hq.nasa.gov/office/codeq/solder.htm

A BGA reports (RoHS related of course)

Electronics Forum | Fri Feb 09 10:00:12 EST 2007 | patrickbruneel

Interesting BGA saga http://www.emsnow.com/npps/story.cfm?ID=24434 To be continued Patrick

A BGA reports (RoHS related of course)

Electronics Forum | Fri Feb 09 11:33:23 EST 2007 | samir

Patrick, the suspense is killing me. What happens next?? I can't wait for the "conclusion."

A BGA reports (RoHS related of course)

Electronics Forum | Mon Feb 12 02:02:25 EST 2007 | lococost

:s I'd be frightened too if I had SAC305 in my balls.

A BGA reports (RoHS related of course)

Electronics Forum | Mon Feb 12 02:17:32 EST 2007 | Wayne

Most of the semi-con is using SAC305 balls. Only the PCB assembly house feels the heat, but semi-con never feels any pressure.


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