Electronics Forum | Mon Sep 21 19:51:54 EDT 2009 | nodlac
We are looking at this stuff all the time...One thing we find is the operators use the Alcohol based hand cleaners....and it drys their skin...then they use moisturizers creating a whole new issue. Just a word of caution. Cal Driscoll Agilent Techn
Electronics Forum | Thu Sep 10 06:28:17 EDT 2009 | rohitfast
1*10E9~11. Pl confirm me about the ESD requirement of this process. How i will ensure that process is ESD safe?
Electronics Forum | Thu Sep 10 11:47:44 EDT 2009 | mikesewell
The adhesive should be a dielectric (insulator) by design, if not it could possibly short across leads of the very parts it's intended to secure. It normally isn't a concern - what is the surface resistance of your soldermask, bodies of ICs, ...etc.
Electronics Forum | Tue Sep 22 08:55:31 EDT 2009 | stepheniii
Second, ESD-stuff > IS very confusing. Largely because people don't > know what they're talking about. I think a lot of that is because of followers following followers.
Electronics Forum | Thu Sep 24 00:42:37 EDT 2009 | rohitfast
Can you pl let us know what was the ESD sensitivity level of your assembly? We are also using plastic stencil from last 3 years and not seeing any major diffficulties in our class-3 product.
Electronics Forum | Sat Sep 12 10:12:20 EDT 2009 | tylaburg
My customer wants an SnPb 63/37 BGA soldered using SAC305 solder paste. What data is avaiable showing the long term reliability of the intermetallics of the solder joints?
Electronics Forum | Sat Sep 12 14:10:38 EDT 2009 | GSx
First, make sure that 63/37 BGA can withstand higher reflow temperature of of lead free SAC305 GSx
Electronics Forum | Sun Sep 13 18:45:24 EDT 2009 | halleyjoan
Is there any possible way to repair the blower of vitronics reflow oven if it stuckup? How to replace its blower? Or i should be replaced as 1 assembly (cell motor and blower assembly).
Electronics Forum | Mon Sep 14 08:07:24 EDT 2009 | davef
You have a board fabrication defect. Search the web for "hole wall pullaway" Performing a microsection is the best way to analyze the defect.
Electronics Forum | Fri Sep 18 09:22:03 EDT 2009 | ysutariya
Don't forget the possibility of excess moisture absorption. If this is lead free, then the laminate manufacturers state that you should bake prior to assembly. Was this completed?
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