Electronics Forum | Wed May 12 01:40:12 EDT 2021 | davef
SMTnet Used Equipment Mart: https://smtnet.com/mart/ SMTnet Equipment RFQ: https://smtnet.com/mart/index.cfm?fuseaction=rfq
Electronics Forum | Tue May 11 08:20:52 EDT 2021 | jineshjpr
Hi Anyone having IPC 4552 A ?? Can You please provide the details of Immersion Gold Thickness Recommendations mentioned in Page 21 & Additional details required for Immersion Gold Thicker Than Specification by Design mentioned in page 23.
Electronics Forum | Thu May 13 16:55:51 EDT 2021 | emeto
With Pb-Free HASL you can't use Pb process for sure as the melting point of tin is so much higher than the lead paste process. SAC305 is the most popular compound, unless your assembly requires something else for a specific reason.
Electronics Forum | Fri May 14 14:46:56 EDT 2021 | emeto
Not following the lead paste process window has a whole set of risks for joints quality and reliability.
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Thu May 13 15:20:43 EDT 2021 | grahamcooper22
Hi, are there any component types that are not suitable for vacuum reflow ? I've had one customer use his vacuum vapour phase reflow system on a pcb, and on 10% of the hermetically sealed accelerometers devices. the lids have popped off... Thanks Gra
Electronics Forum | Fri May 14 20:21:11 EDT 2021 | bandjwet
Thanks for the reply. We are ramping up using soldering techs and convective hand soldering. We have investigated w/many soldering robot vendors. The number of units is over 100K. We will be automating using a dispense+pick and place for greater c
Electronics Forum | Sat May 15 20:32:55 EDT 2021 | dunks
Could you setup bga rework style machines with custom nozzles? Assuming your manual convection process consists of technicians with hot air pencils, and depending on part locations, this could potentially replace the manual part of that process.
Electronics Forum | Mon May 24 23:38:17 EDT 2021 | SMTA-64387687
What about dispensing SMT epoxy (cures at much lower temperatures, than solder reflow), p+p components, run through the oven to cure, and using a laser selective solder robot to solder the pads?
Electronics Forum | Sat Jun 05 13:55:14 EDT 2021 | ppcbs
With a reflow oven or BGA Rework Station I doubt you will get better than 2.5 minutes. Using a hot air pencil with about a 1/4" nozzle you can probably get 30 to 60 seconds depending on the density of your PCB?
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