Electronics Forum: electronic (Page 5496 of 7930)

Board support issues

Electronics Forum | Thu Sep 20 11:22:13 EDT 2001 | ert002

Sorry for not getting back sooner.. a virus attacked our network yesterday. The experiment you have outlined is what I had next on my list...just trying to see if anyone had done it before. We will be experimenting with 0.004" and 0.005" thick sten

Dek compared to MPM

Electronics Forum | Wed Nov 07 02:41:58 EST 2001 | marshall_shuai

Dear Mr. Jeff, Our SMT room are using the DEK288 and MPM2030 Printers at the same time. We found the similar problem also as mentioned by MR.JOHNW. We analysis it was mainly caused by the PCB metal fixture used in DEK288. The PCB metal fixture is

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 01:41:23 EDT 2001 | shvetangcd

Hi Jeff, We are having solder-short problems for BGA, QFP, and some other fine pitch parts while using DEK screen printers. The PCB is processed on the second half of the line for screening the side with BGA, QFP, and other fine pitch parts. Which m

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 18:36:59 EDT 2001 | mparker

... and don't forget proper stencil alignment. Invariably I find most bridging problems for fine pitch parts, etc. is caused by lousy alignment. The alignment must be verified under magnification, using the naked eye is not good enough. Use at least

PCB finish - Printhead vs Squeegee

Electronics Forum | Tue Sep 18 13:21:06 EDT 2001 | fcouture

Hello Jeff, I found some good information from what I read until now...so thank you! I have two questions: 1) What finish did you use on the PCB for 0201 ? I think with an aperture so small (12x15mils) tin plated is impossible, what do you think

PCB finish - Printhead vs Squeegee

Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture

Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab

OT: HNC Mechantronics

Electronics Forum | Fri Oct 05 13:11:42 EDT 2001 | darren jones

hi all thanks very much for the replys...gettin well into the swing of it now...been a few years since i used a calculator properly!!! I also have to do a project which i have to present and write up about. I would like to be able to do something

PROBLEMS WHILE GLUE PRINTING

Electronics Forum | Thu Sep 20 16:51:31 EDT 2001 | jschake

Using an enclosed pressurized printhead system will significantly reduce the waste produced compared to printing glue using squeegees. In trying to stay with the 0201 theme here, I will add that printing glue or adhesive for 0201s continues to be a

reflow profile

Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas

You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica

Inspection Equipment

Electronics Forum | Tue Sep 25 15:11:34 EDT 2001 | Rich Elensky

I have had good experience with the 6500. We used it to inspect both SMD and TH devices. (presence, polarity, correct part) I would suggest you contact CR (now Phton Dynamics) for the latest software. It has some serious improvments over early rel


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