Electronics Forum: electronic (Page 6216 of 7930)

MPM UP2000HiE motherboard replacement

Electronics Forum | Mon Apr 28 21:51:56 EDT 2014 | elabcircuits

Hello, We have a MPM UP2000 HiE printer from 2000, software version 7.2E. The PC board is not booting anymore (black screen), no drives spinning. It's an Advantech 486SX version. Question: would a Pentium 3 SBC (Single Board Computer) with ISA

New facility flooring choices TILE, EPOXY, rubber tile, sheet, carpet

Electronics Forum | Tue Apr 29 15:04:08 EDT 2014 | gregcr

Hi All, We will be building out a new production area and am looking for your opinion on what flooring system to install. We currently use ESD VCT tile that was installed about 16 years ago. The area will be SMT equipment as well as some assembl

Yahoogroup Started for Assembleon Philips Yamaha SMT machine users

Electronics Forum | Sat May 03 10:20:47 EDT 2014 | proy

https://groups.yahoo.com/neo/groups/Assembleon-smt/info See above, I have created a yahoogroup for Assembleon, philips, Yamaha users (a while ago I created a yahoogroup for zevatech and have since moved on, but it is still alive with some 75 active

Electrolytic capacitor

Electronics Forum | Sat May 03 14:06:25 EDT 2014 | jyo_409

What are the possible reasons for electrolyte leakage What is the purpose of the vent in the capacitor? Why vent is not being maintained for all types / values of the capacitors? What is the significance of the end seal configuration. Why end seal co

LGA... where to start?

Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon

There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b

LGA... where to start?

Electronics Forum | Fri May 09 14:40:38 EDT 2014 | hegemon

I might start with the equivalent 4 or 5 mil stencil and 1:1 on the apertures. If voids are too prevalent, then I would tin the pads of the device, remove the solder, and then solder as above. You may have another hurdle, in that the resulting stan

Quad QSV-1 randomly destroying Z-rods

Electronics Forum | Fri May 09 05:09:41 EDT 2014 | col_d

We're having an intermittent fault with a QSV-1 where it will on occasions oscillate violently during a run and this usually results in 1 or both Z-rods being destroyed, along with the nozzle currently fitted. This has been on and off for the last 2

low thermal emf solder & paste - SAC 405

Electronics Forum | Mon May 12 04:26:00 EDT 2014 | gazelle

Hello - I am looking for a source to supply low thermal EMF solder - can anyone provide pointers ? In the past a cadmium - lead alloy was used for this, but these are banned (RoHs) ... - the aim is to minimize thermo-couples on a very sensitive 4 lay

low thermal emf solder & paste - SAC 405

Electronics Forum | Tue May 13 08:59:13 EDT 2014 | gazelle

Hello davef - could it be you are confusing low thermal emf (Seebeck coefficient) with low temperature solder ? I am looking after solder wire and paste with low Seebeck coefficient - cadmium based alloy was OK but banned in europe due to RoHs direct

low thermal emf solder & paste - SAC 405

Electronics Forum | Tue May 13 17:53:54 EDT 2014 | anvil1021

Hello Michel...this might be a bit of a battle finding the low thermal EMF material that you are looking for. The first one that comes to my mind is Bismuth Selenium Telluride, with either a nickel or cobalt doping agent. Silver went away from this


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