Electronics Forum: electronic (Page 6476 of 7930)

Re: MultiCore Brand

Electronics Forum | Fri Aug 11 08:52:11 EDT 2000 | vickij

Kyle: I have also used the Kester, and the biggest difference I found between the two is that the MultiCore is a lot thicker. I had to make some printer adjustments to use the Kester; I had to use a little less squeege pressure to get a clean print

ICT sites under BGAs

Electronics Forum | Wed Aug 09 16:30:43 EDT 2000 | MarkS

Has anyone had (successful) experience placing testpoint vias under BGAs? We already have conventional vias, but we're contemplating converting them into testpoints (probably by enlarging the bottom-side copper diameter to .036" and opening the bott

Re: Board Warp And Twist

Electronics Forum | Tue Aug 08 20:43:41 EDT 2000 | Dave F

Tom: So is warp or is it twist? They�re different problems, possibly with different sources!!! And possibly different solutions!!! Consultants to talk to are: Earl Moon (pod@vcn.com), Werner Engelmeyer (engelmaier@aol.com), Les Hymes (les.hymes@w

Re: solder balling

Electronics Forum | Thu Aug 10 03:30:42 EDT 2000 | JohnW

Ramon, Solder ball' are a bitch aint they?, identifying the right location to fix em is a bigger one. As you and the rest of teh guy's have said yes you'll need to look at your stenil..but maybe your stencil is good so you'll need to look else where

Re: Clamshell printers

Electronics Forum | Fri Aug 04 15:45:27 EDT 2000 | John Thorup

Ditto to everything said. If everything in the process is correct you will have good success at 25 mil but it will take much care. I have done 20 mil on this type of printer but, as Steve says, I wouldn't want to on a daily basis. Those wipe-offs a

Re: LGA Stencil Spec

Electronics Forum | Sat Aug 05 09:06:40 EDT 2000 | Dave F

I'm confused ... Land Grid Array (LGA). An alternative to the BGA for device manufacturers is to package their devices without any terminations on the bottom. Although not technically accurate, the easiest way to envision an LGA device is to pictu

Re: Rework station evaluation

Electronics Forum | Tue Aug 01 00:34:45 EDT 2000 | Antonio

I have evaluated SRT, Air-Vac and Conceptronic rework stations. All three machines offer great BGA and Micro BGA rework capability. But the one I have preferred is the Conceptronic Freedom 2000, as a matter of fact I have purchased two freedom 2000 i

Re: wave solder bridges

Electronics Forum | Thu Jul 27 12:54:53 EDT 2000 | John Thorup

Hi Jason I think Wolfgang has this one nailed. If it's the same four pins every time and nothing changes this, even rotating the board 90 degrees, then you're probably going to find something like a ground plane connected to them. I don't think sol

Re: wave solder bridges

Electronics Forum | Sat Jul 29 00:44:30 EDT 2000 | Jason

Thanks for all the ideas. I tried solder "thieves" by placing some desoldering wick behind the briging pins and it worked! I have yet to try Chrys' idea but I will first thing Monday. This is a new board that has had this problem from day one. I

Re: Paste-in_hole and CTE

Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan

Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e


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