Electronics Forum | Sat Nov 18 21:20:58 EST 2006 | Fer
Dave, May I ask where did you find the 1.5%, or the goal of .005" (or .007") per inch? The IPC-A-600 bow and twist standard calls for a .75% based on the calculation of the test method TM-650, method 2.4.22, which calculates the percentage based on
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Mon Nov 27 16:52:18 EST 2006 | greg york
Hi Bill Mostly in the UK, but originally saw the problem when I helped on one install in Malta on a chinese mc set at 5 degrees and had nightmare bridging. changed the angle to 6.5 ish and results were instantly better actually better than what they
Electronics Forum | Tue Nov 28 15:49:33 EST 2006 | Kerwin Hooshey
Grant, but that doesn't change the fact that you have to run the board again a half-hour-later...hahaha. Also, the Chinese are FAR from being innovators...rather, they're out-of-control "immitators" of products, breaking patent laws and reverse engi
Electronics Forum | Tue Nov 28 22:34:55 EST 2006 | davef
Almost all boards are hydroscopic. In this, the epoxy holding the board together absorbs moisture. Almost all components are hydroscopic. In this, the epoxy encapsulating the component together absorbs moisture. So, as you heat the board / compon
Electronics Forum | Tue Nov 28 17:23:03 EST 2006 | flipit
Flash gold usually refers to electrolytic gold with a short plating time. In other words gold plating that requires current to plate. If you have bare copper under your soldermask, the gold is probably ENIG. The only other way to have bare copper
Electronics Forum | Tue Nov 28 08:27:05 EST 2006 | davef
Choices are: * IPC-RB-276 [superseded by IPC-6011/6012], Section 5 discusses some basic shipping and packaging requirements. Also, it references ASTM D-3951 and MIL-P-116. * Universal Instruments has done a nice job putting together a packaging speci
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Wed Nov 29 01:09:17 EST 2006 | Guess
I would suggest checking the feeder, MVF and MSR are both turret type and dont have the capability auto pik adjust in y. Y offset pick up would lead to : 1. Over turn component. 2. Missing component. Turret sequence is pick, recognize an
Electronics Forum | Thu Dec 07 10:05:18 EST 2006 | Learn from U
Hi all, Sorry for the late reply..I am sure it is flux residue..Found no such symptom as Grey mention above. This is non clean process and no way we can clean this whole big board(Server) with any kind of flux removal...Currently, the ICT probe pre
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