Electronics Forum | Thu Oct 24 17:32:54 EDT 2002 | ksfacinelli
The big problem we saw was the appearance of the solder joint after the water wash process. We saw the joints turn white through the absorption of moisture. Looked real bad but still functioned. I would stick with using only one of the processes a
Electronics Forum | Tue Oct 29 05:22:38 EST 2002 | kent
Thankyou very much for the information. Another question, what are the difficulty of dealing with the larger ball and tighter pitch? What is size of the ball is consider large and how far the distance for pitch is consider tight? Currently I have
Electronics Forum | Mon Nov 04 12:50:23 EST 2002 | babe
Sorry for being late on the reply. Whatever you do, flux from the container or the manufacturers flux pens. Stick witht the same chemistry. Mixing chemistries, IE: different fluxes will create more problems in rework than you will see if you use the
Electronics Forum | Fri Oct 25 16:40:06 EDT 2002 | davef
Nor ment as a criticism of anyone, but you really need to become intimate with your stencil supplier. This is not one of those "throw it over the wall" buying relationships, like you can have with buying pencils. View this an opportunity to develop
Electronics Forum | Fri Nov 01 00:12:16 EST 2002 | Darby
Ive always preferred "Put another log on the fire" for those emotional moments. Why don't you tell a couple of these purveyors of print that you haven't got a clue. See who is the most helpful in giving you some time and knowledge so that you then ha
Electronics Forum | Fri Oct 25 11:57:34 EDT 2002 | ricardof
Hi, I would like to know what would be the main steps to set-up a COB process? or what would be the main requirements to accomplish this? (eqipment: Die mounter, wire bondig, etc. Documentation: Certifications, etc. Plant readiness: Lay-out, eytc), I
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Tue Oct 29 11:01:56 EST 2002 | yngwie
Ok..I will refer to the past thread myself....but, just an update, after getting the BGA rebaked ( as I didn't see an evidence from Production saying that they hv baked these batch of BGAs). The shorts are all gone. But one thing thou', if the proble
Electronics Forum | Sun Oct 27 07:56:58 EST 2002 | wongmanchung
Does any expert here know the specification of board deflection when we mounting component by pick and place machine? That is when the nozzle place the chip on the pcb, the board will have some deflection. And are there any requirment that we need t
Electronics Forum | Wed Nov 06 12:52:28 EST 2002 | charlie
Check out one of the board suppport that are currently available: Grid-Lok, Formflex and others. These systems are available for many models of printers and P&P. They automatically set up to any board, first or second side, and provide excellent su
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
2747 Loker Ave West
Carlsbad, USA
Phone: 18002796835
