Electronics Forum: electronics (Page 4426 of 7930)

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Electronics Forum | Tue Nov 29 14:01:47 EST 2005 | Samir Nagaheenanajar

Okay, "LeRRY" . In light of recent postings where certain individuals keep touting their "free stuff", funny how THIS post suddenly surfaces, and "free material", which has recently been shoved down the forum participants' throats, also surfaces on

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Electronics Forum | Mon Dec 05 09:38:35 EST 2005 | rlackey

Surely not? I thought it was all free & we were heathens (at least I'm guessing that's what the cable guy insult was meant to mean)for not welcoming it with open arms. O well, back to my biggest technical problem of the next two weeks - what SPF r

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sun Dec 11 08:13:27 EST 2005 | stepheniii

If you are taking off the old BGA then the board finish is not the same as it was orginally. I would want to clean the pads off as much as possible and then use sticky flux with the new BGA. But on the other hand, Aim solder has an article about smal

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Wed Dec 14 21:49:18 EST 2005 | grantp

Hi, Yes, I would be interested to know what the nature of the high failure rate is with using lead free BGA parts with a lead process. I had been to a seminar where they said it was ok, but not ok to use a lead BGA in a lead free process. Regards,

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Fri Dec 16 20:22:44 EST 2005 | Homer J

There are some RoHS BGA:s that are within the "so called" solder joint strength & reliability, that can be solder in a non LF-environment! Certaininly LF-free or RoHS BGA will sometimes work the other way around. (I know about the ball melting point)

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 17 19:24:58 EST 2005 | mika

AMD and this is the MPN: Asch, I have for some reason lost it, but I will find it later on, if You still think it is necessary. After that we have read through the latest postings we think this is even more important and it seems that we are not alon

More Specifics Needed - USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Mon Dec 19 12:23:49 EST 2005 | Amol Kane

there are no issues with running leaded lead free parts with snpb solder. the problem arises when lead-free BGAs are run with SnPb solder. running hotter (i.e mimicing the SAC reflow profile)merely ensures that the sac solder melts and mixes with the

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sun Dec 25 17:55:56 EST 2005 | Mika

No one seems to have firm research that says one thing or another. It's all just "some guy told me" kind of stuff, and that's a worry. >Without firm absolute data, it's all a guess or rumor, which has a huge chance of being incorrect. >Does anyone

Solder wetting issues

Electronics Forum | Fri Dec 02 08:57:39 EST 2005 | russ

You hit it on the nose Pavel, the fluxes in paste are formulated to have 2 activating points if you will, one at low temp and one at high temp. when the low temp flux gets killed this is what you will see. This is the main reason we opted out of K

ATC Fail Criteria

Electronics Forum | Thu Dec 01 14:47:25 EST 2005 | Amol Kane

Hi, I am testing some lead-free assemblies using ATC. it was suggested to me that if i do in-situ testing, then i should measure the starting resistance, and subsequent resistances values after n cycles, and when the resistance value increases by 1 o


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