Electronics Forum | Fri Sep 03 03:49:24 EDT 2010 | sachu_70
In case of pure pattern recognition, i agree with your view. However, the basic functionality of the fiducial is determine any positional offset of the PCB and provide necessary data for correction during the intended operation such as Paste printing
Electronics Forum | Thu Aug 12 22:14:49 EDT 2010 | jdm2008
Anyone out there have this system(optima 7300). We have it and we are having tons of problems. Access violations, "ghost windows" models that when deleted will still call out defects, constant crashing etc. We are wondering if the problem will be
Electronics Forum | Tue Aug 17 11:24:04 EDT 2010 | namruht
I have a question that has been discussed many times, but is always good to get some new insight. We have lots of issues with our no clean process. We use a Kester EP256 solder paste. I would just like to get some general tips on how to get rid of mi
Electronics Forum | Tue Aug 17 12:27:48 EDT 2010 | namruht
That reminds me...We already have home plate apertures on our stencil. Try number 2...I tried an overall reduction based on the copper layer of 10% and used oval apertures. I hope that you guys can suggest something that I am over looking. I know tha
Electronics Forum | Tue Aug 17 13:36:17 EDT 2010 | hegemon
Since you have home plated the apts and done solder reduction, I would take a look at your soldering profile. We have run into this before when running no-clean and found that reducing the initial ramp rate to the flux activation was a help in the
Electronics Forum | Tue Aug 17 14:34:27 EDT 2010 | davef
Comments are: * Too much paste ... reduce it more. * Do not let a traces run between small discrete pads or the heat of reflow will pull a ball to the trace, we can repeat this. * Change the placement height on chip parts to reduce solder spread / mu
Electronics Forum | Tue Aug 17 16:07:23 EDT 2010 | scottp
Are you controlling humidity in your plant? I'm not familiar with that particular paste, but some pastes are sensitive to a humid environment. We also had one paste supplier send us a batch that had excessive solder balls if the boards were printed
Electronics Forum | Thu Aug 19 16:03:04 EDT 2010 | kpm135
Are you reusing your paste or putting down new every time? I've seen solder balls before when operators try to use the paste past the recomended stencil life. I've also seen it happen with a bad batch of solder paste from a vendor.
Electronics Forum | Fri Aug 20 09:40:56 EDT 2010 | namruht
kpm, We were afraid of that, so we have tried several variations with paste usage. New paste, transfered paste from another line, and a new tube from another date code. I think the problem is profile, board design or humidity. I just have to starti
Electronics Forum | Sat Aug 21 02:08:00 EDT 2010 | isd_jwendell
I have noticed that the % metal content in the paste can also be directly correlated to solder balls (less metal, more balls). However, I also found differences between pastes from different manufacturers and the number of solder balls (identical boa
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