Electronics Forum: electronics (Page 5136 of 7929)

SMT machine

Electronics Forum | Wed Jun 10 16:19:04 EDT 2020 | zgulkhan

I've built SMT pick and place machine at home .. please have look https://www.youtube.com/watch?v=FrGPu49nKsw I want to add vision system to it using C# any help or hint may highly be appreciated (please don't mind my english) thanks...

SMT machine

Electronics Forum | Thu Jun 11 14:09:43 EDT 2020 | emeto

Awesome machine! For grabbing the image and addressing camera quick you should get a camera with card and eventually application software. These are industrial and more expensive. 1394 interface is very common interface for the industry. Once you hav

HASL surface finish

Electronics Forum | Fri Jun 12 21:36:04 EDT 2020 | SMTA-Josh

Has anyone had an issue with changing from a HASL surface finish to a LF HASL finish if it is still being used in a leaded process? Also we are having issues with the planarity on the fiducials with the HASL finish. Are there any suggestions or ch

HASL surface finish

Electronics Forum | Sun Jun 14 03:02:14 EDT 2020 | kylehunter

We did a batch of boards with lead free HASL that we thought was leaded. Using standard leaded paste worked, but we did have some wetting issues. The issues were resolved when switching back to leaded HASL. Can't speak to your specific fiducial issu

HASL surface finish

Electronics Forum | Mon Jun 15 16:51:05 EDT 2020 | emeto

Tin/Lead has 183C melting point and probably around 220 peak temperature at reflow. Tin has 232C melting point. I would assume that based on this information you would understand why intermetallic joint is questionable. Go to any flat finish. HASL wi

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 16 18:03:41 EDT 2020 | rsatmech

Thanks for your response. Shorts are happening in different locations(Not same pad repeated) .kindly note these are happening one in 10kThat's the challenge to understand the exact issue. Only one short. Vias - i will check and updated. Yes it's

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 16 19:41:46 EDT 2020 | emeto

Voids form mainly two ways. 1. Contamination - due PCB pads/part leads oxidation, wetting on the pad is bad forming void(these are usually borders with SMT pad - peripheral) 2. Process formed. These are in the center of the solder joint - could n

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 16 20:48:14 EDT 2020 | rsatmech

Point one -; I am also having this concern but based on the DPM it's getting difficult to keep the track to understand what exactly happened with the particular PCBA (Attrition component placed or Cleaned PCBA due to some issue those components are p

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Wed Jun 17 14:29:06 EDT 2020 | emeto

These are great pictures. I have never seen this kind of solder repelling from the pad. My number one suspect now is the PCB. Your focus should be on board plating and contamination. The easiest test is to have meaningful batches from another board h

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Thu Jun 18 16:15:42 EDT 2020 | rsatmech

Usually board house should inform you of these. Here supplier works differently. We generally don't get these updates. Only the ODM or customers get. We only find when we are facing any issues. Can you please enlight me on how to check the value


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