Electronics Forum | Sat Nov 04 20:17:25 EST 2000 | Greg G
Hi Guys, I'm sorry to ask you this, but I got mixed infos from the archive. I want to define a process in wave soldering regarding bd-wave interaction. Now "What's the required dwell Time of a lead in the solder bath?" Some says 3-5 secs is good, som
Electronics Forum | Sat Nov 04 22:26:33 EST 2000 | Aoki Laboratories Ltd.
Greg, The operating parameters for Wave Soldering are: 1. Preheat Temp. (80-110 c, board surface); 2. 1.5-3 secs dwell time in solder. This, 1.5 second, is the time required for both the lead and solder to gain sufficient heat and as a result "tinn
Electronics Forum | Tue Nov 07 08:39:12 EST 2000 | Steve Geldard
Hi Guys, Ive seen your notes on Wave dwell times, we have been doing lots of test across many styles of wave machines. The most inportant thing to understand is that your dwell time does vary across the wave, it can vary as much as 2 to 5 secs from
Electronics Forum | Fri Nov 03 08:27:11 EST 2000 | CAL
1) You also may want to contact your OEM to see if there is interest in purchasing the equipment. You did not state the age or condition of your equipment but the OEM's are buying back machines and refurbishing them for resale. The long lead times OE
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Wed Nov 01 10:03:42 EST 2000 | Wolfgang Busko
Hi Adam, if your product needs the full width of your wave you won�t have any chance to adjust an angle. For smaller PCB�s you might consider having your carriers made in two pieces. One outer piece to match your transportionsystem and one inner cir
Electronics Forum | Wed Nov 01 12:04:46 EST 2000 | JohnW
Adam, Didn't we do this already?, check the archives, I've discussed rotational carriers before. You can use them fo setting up an designing the pallet but you can't use them for mass prouction, for one your waisting valuable pallet space, for anoth
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Thu Nov 02 03:42:49 EST 2000 | CHRIS MAY
Tombstoning primarily occurs due to the fact that the paste may melt and wet the metallized face of the chip earlier or better at one end than the other. This could be due to a difference in heat capacity (thermal shadowing ?) or that one end of your
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