Electronics Forum | Tue Apr 10 16:41:21 EDT 2001 | slthomas
OK, you're talking about inline AOI doin' all the work for you, for a price. Fair enough. If you can't afford the inline post-print inspection equipment, though, I still think you can depend on the 2D inspection of the paste to tell you if you've
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
Electronics Forum | Fri Mar 30 18:24:12 EST 2001 | davef
There is no test. Beyond the issues that you mentioned that affect shear, an article published in a recent [1/01] "Journal Of Surface Mount Technology" documents that shear is also dependent on the rate of shear. You may be able to contact the auth
Electronics Forum | Sat Mar 31 08:47:24 EST 2001 | davef
Sure, researchers measure shear as an element of their material characterization process, but that does not make it an acceptance test. [Truly, this conversation is not uncommon on SMTnet. So, it would not surprise me if an enterprising something o
Electronics Forum | Tue Apr 03 12:00:55 EDT 2001 | Steve
I am looking for standards that describe acceptance criteria for PCB's. Anyone.....anyone.....Buhler. My company is an OEM manufacturer and I want to know what to look for when we receive PCB's from our PCB fab vendor. Specifically, solderability an
Electronics Forum | Wed Apr 04 08:57:13 EDT 2001 | Cal
IPC-TM-650 is a works well. Ionic conductivity is a good rule of thumb but I prefer ION Chromatography this will help determine the residues left behind from the fab process. There are a bunch of ways to determine solderabiltiy- Wet Balance and SERA
Electronics Forum | Wed Apr 04 08:28:27 EDT 2001 | Cal
ZAM_BRI- I don't know how effective this may be but some points to include in the buy-off procedure: Before submitting the PO for the stencil you may also want to do a CAD to Stencil comparison to verify correct apertures.There are SW packages and co
Electronics Forum | Wed Apr 04 09:50:14 EDT 2001 | bdoyle
Funny you should mention that. I had noticed that there were many duplicate listings in the career center and I've been working on fixing that this morning. I'm also adjusting the display so that it shows the date posted for each listing both on th
Electronics Forum | Wed Apr 04 12:02:33 EDT 2001 | Adam
Guys Is it possible to completely eliminate random solder/microsolderballs from No-Clean products that go over the wave. The Assembly is a mixed technology product which is HASL finished. All profile types have been exhausted, 3 flux vendors have be
Electronics Forum | Wed Apr 04 12:35:15 EDT 2001 | davef
These solder balls are where [top / bottom]? Describe the breadth and degree of this problem across all assemblies. Finally, describe your wave solder machine, a common profile for this board, and the board [beyond that it's mixed tech, like are
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