Electronics Forum: enig shadow (Page 1 of 1)

HASL surface finish

Electronics Forum | Mon Jun 15 16:31:25 EDT 2020 | rgduval

You may find some wetting issues running LF HASL with 63/37, as your reflow temperatures will be significantly below the LF reflow. On fiducials...if you don't have a quote for your boards with ENIG, I would recommend at least checking it out. It's

THM Solder barrel fill issues on 93 mils board

Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew

I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef

O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there


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