Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
9개 존을 갖춘 무보이드 진공 리플로우 솔더링 오븐. 균형적 흐름 기술이 있는 무보이드 / 진공 리플로우 솔더링 질소 시스템 9개의 탑 및 바텀 가열 존 - 업계 최고의 직선형 피트당 최고의 존 수! 100인치 가열 길이 - 고처리율 제공! 2개의 내부 냉각 존 - 최저 출구 온도 제공! 총 길이 180인치 - 바닥면적 활용 최적화! 10인치 모듈의 새로운 모듈 디자인이 프로파일을 보다 작은 세그먼트로 세분화할 수 있는 유연성을
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef
You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS
Used SMT Equipment | SMT Equipment
Features: 1. Heating system 1.1 Independent heating models are located with top and bottom with single hot air circulation in each zone. 1.2 All the heating zones are controlled by PLC through PLD, 1.3 Each zone is heated step by step, thus reducin
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2008-03-07 11:47:13.0
Minneapolis**, MN*� The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Kauai, Hawaii was a great success. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
9개 존을 갖춘 무보이드 진공 리플로우 솔더링 오븐. 균형적 흐름 기술이 있는 무보이드 / 진공 리플로우 솔더링 질소 시스템 9개의 탑 및 바텀 가열 존 - 업계 최고의 직선형 피트당 최고의 존 수! 100인치 가열 길이 - 고처리율 제공! 2개의 내부 냉각 존 - 최저 출구 온도 제공! 총 길이 180인치 - 바닥면적 활용 최적화! 10인치 모듈의 새로운 모듈 디자인이 프로파일을 보다 작은 세그먼트로 세분화할 수 있는 유연성을
Career Center | , British Columbia Canada | Engineering
Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowle
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
