Electronics Forum | Wed Aug 19 12:20:24 EDT 1998 | MARK J.
| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Mon Jul 27 03:20:42 EDT 1998 | Frank J. de Klein
Dear Dave, Sure we can ! There are two values going around. One is 50 mg/mm2 The other one is 30 g/inch2 (30 * 1000) / (25.4 * 25.4) = 46.5 mg/mm2 So we are talking the same language. Regards, Frank J. de Klein | | | Hi, | | | We have encountered one
Electronics Forum | Fri Jul 24 08:52:42 EDT 1998 | Justin Medernach
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Sat Jul 25 00:09:13 EDT 1998 | Phillip Hunter
Use caution if epoxy is dispensed under the PLCC 84. If the "SMT Gods" look unfavorably onto you rework will be difficult. I had a ceramic PLCC 84 which weighed 15 grams (MCM) and due to packaging failures (glass seal to metal cover) rework was the
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Mon Jan 05 16:07:21 EST 1998 | Terry Burnette
| | Hello all, | | I have experienced broken ceramic SMT parts. Most of the time, | | we have found fractured inductive beads. Once in awhile, we find | | broken Ceramic Caps. All parts we use are 1206 form factors and | | we use tape and reel...
.gif)
