Electronics Forum | Fri Feb 13 10:13:56 EST 1998 | Simon Washer
Has anyone running the cp4-3 feeders (MC type) in 8 by 4 td flavour seen excessive wear on the aluminum body caused by the tape leaf cover and tape leaf retaining clip?? These are the black anodised aluminum feeders (new type) that we run on all cp4
Electronics Forum | Tue Jan 20 06:46:39 EST 1998 | IgmarG
This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Qu
Electronics Forum | Thu Jan 29 08:33:34 EST 1998 | Mike Moninger
| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi
Electronics Forum | Wed Jan 21 22:35:01 EST 1998 | Scott
| Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this c
Electronics Forum | Wed Aug 22 21:11:25 EDT 2001 | davef
When it works right, it's a beautious thing. => When goes wrong, you have one board with some of the other board's material, not too coo. Scribed and broken ceramic has bad-butt sharp edges. You'll feel this sticky stuff on your hands, look down,
Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman
If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle
Electronics Forum | Tue Sep 25 14:25:30 EDT 2001 | davef
Points in response are: * Microstencils work fine with paste, although they are a little fussy to use. * Never have used microstencils for flux. * Like Hussman, we dab the uBGA into a puddle of tacky flux and then place it on the board. * On contro
Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Thu Jan 24 04:54:43 EST 2002 | wbu
Well Greg, I don�t know YOUR 0805 Pads but if you look at the recommended pattern for 0805 in IPC-SM-782 you might notice that the Z-dimension is somewhat about the size of your 1206 part length. With that and assuming that you ask if the results wi
