Electronics Forum | Wed Feb 15 15:27:35 EST 2006 | russ
Put this one out a little early! I just looked at the data in the Kic site and also at the other place, it is interesting how the results are different except for the high temp solder which we should have all expected. Now for my question Do we re
Electronics Forum | Fri Feb 24 10:33:13 EST 2006 | MikeL
I know what you mean. Saw this in systems where cooling was not done through the reflow nozzle (i.e. PACE). What happens is that as you run 1-2 profiles, the metal parts along the pathway of the hot air (before it comes out of the nozzle) act as he
Electronics Forum | Thu Apr 20 13:50:28 EDT 2006 | fredericksr
All, Does anyone sell a safe and effective way to connect a DMM to building ground via a power outlet? Personally, I'm comfortable using a banana plug, but the people that are going to be performing this task may vary in electrical understandin
Electronics Forum | Tue Apr 25 22:16:31 EDT 2006 | KEN
I agree with Russ. The problem is your thermal isolation is so small 1/16 inch. Also, most ovens measure temperaure in the plenum. You don't solder in the plenum. Therefore, you have a intermidiate "zone" temp. mixing between the top and bottom
Electronics Forum | Wed May 10 00:27:46 EDT 2006 | Chris
Russ, By a longer profile you mean a more even slope across the entire profile. Unfortunately I only have a 5 zone oven that is fairly short. How many heated zones are you using? Did you shrink the 0402 pad design and leave less pad exposed out a
Electronics Forum | Thu May 11 15:11:14 EDT 2006 | patrickbruneel
I assume you talk about wave soldering. No-clean fluxes are widely used since 1987 or earlier and after all these years they have proven to be reliable. If you clean the board or not the dust bunnies etc. will still reach the board surface. If you us
Electronics Forum | Thu Sep 14 20:11:19 EDT 2006 | davef
You weren't specific about the OSP that you use. We use Entek Plus CU-106A. Yes, just about everything removes Entek, especially if there's heat involved. Ethone states: * Alcohol strips 70% of the coating * Water removes 15% * Kyzen Lonox only t
Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger
Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t
Electronics Forum | Tue Nov 07 18:56:40 EST 2006 | Steve
Thanks guys! Very helpfull info. SWAG, the manufacturer states that this material can withstand up to 350 Celsius for a short time period (around 10-20 seconds). It is my understanding that Durostone absorbs heat very very slowly like ceramic thus
Electronics Forum | Mon Dec 18 13:00:34 EST 2006 | realchunks
Hi John, Depending on your board, it could make a difference. Copper finishes might leave that part of the pad exposed, which is a no-no in most places. Where as a HASL board prolly won't care if you pulled the print back. On the other end, over
