Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
Electronics Forum | Fri Apr 14 11:00:38 EDT 2000 | Dave F
Mario: Your ask a very broad question and give no background information. Generally, the amount and type of residues present on a printed circuit board at the very beginning of a SMT line depends on the exposure of the board up to that point. For
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Tue Aug 07 01:16:27 EDT 2001 | mugen
When I was reading the smartsonic fantasy, I ended hospitalized for infectious laughs, and side split'in stitches..... Now that cold reality has eased my pain, I must with calm headed purpose, mark my agreement to the Mr.Sean, that salespersons can
Electronics Forum | Wed Feb 09 21:33:32 EST 2000 | Dave F
Ashok: I have three answers to your questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opene
Electronics Forum | Sat Feb 05 05:10:53 EST 2000 | Dean
It would be helpful to have some additional info on your line and process. Lets make some assumptions... Consider: re-tooling costs for your fab supplier. Can your supplier hold the additional tollerences for a larger panel. Can your supplier fab
Electronics Forum | Thu Jan 13 15:19:51 EST 2000 | Dave F
Hey Jack: It's certainly "do-able." Conformal coating adhesion testing was done as part of the "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia Na
Electronics Forum | Sat Aug 14 01:21:29 EDT 1999 | Dean
| | Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | | | TX | | Mark | | | I have used thetechni
Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A
It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
.gif)
