Electronics Forum | Tue Apr 03 08:38:34 EDT 2012 | tombstonesmt
Yesterday morning wasn't the first time I noticed this condition. We remove the dross from the pot twice a day and once a week we remove the pump assembly and it still produces this type of dross. I googled this situation and some factors of this par
Electronics Forum | Mon Jun 11 17:47:54 EDT 2012 | tombstonesmt
Pete B *We do lines of soldering @ 10mm/sec *Similar solder balls were present on product after soldering. *UPDATE SOLUTION* We began using topside preheat while fluxing the board to reduce the thermal shock factor in addition to replacing the "fi
Electronics Forum | Tue Jun 05 09:51:24 EDT 2012 | markhoch
I'm not using it, nor do I know of anybody that is, but when I saw it at Apex a couple of years ago, my first thought was that the cycle time of the machine was almost always going to prevent it from being installed in a line where throughput was a c
Electronics Forum | Wed Jun 06 21:58:39 EDT 2012 | davef
Higher temperatures are the primary reason that there are more solder balls with selective soldering than in wave soldering. Possible causes are: * Solder mask type is the most important factor ... Solder resists becomes stickier at higher temperatur
Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp
Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan
Electronics Forum | Thu Sep 19 12:29:57 EDT 2013 | deanm
What is your plan/budget for your reflow oven and paste printer? Those are equally important as a placement machine. Have you factored in other costs of in-house assembly such as inspection, moisture sensitive device storage, rework tools, cleaning p
Electronics Forum | Tue Jun 24 12:56:26 EDT 2014 | jmathis
Hello, As our company has begun doing an increase production of contract manufacturing I have seen more and more designs with the 0402 pad layouts that are smaller (.015 in width) than the component. Also there is only a .008 longer than the 0402 p
Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer
I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm
Electronics Forum | Tue Feb 24 09:56:03 EST 2015 | akashicind
Hi, It depend on your budget,try to buy those maker can support spare & service . No meaning you buy high end machine but no service support. Try to find regional agent can support on call upon machine break down. Also other factor hand
Electronics Forum | Mon Jun 01 05:20:57 EDT 2015 | alexeis
Hi, I agree with Buckcho. Further to what was said here, our customers perform preliminary simulations to discover potential problems in production. To do so, they use software tools such as QPlan and QPlace UPD. QPlan automatically detects and fix
