Electronics Forum | Thu Nov 03 04:31:21 EST 2005 | arnold
davef, how can you convince me that 100Sn dissolved copper much faster?
Electronics Forum | Thu Nov 03 07:22:16 EST 2005 | davef
arnold: I did not say that Sn100 dissolved copper faster. The graph of dissolution rates [from the link above] shows that Sn100 dissolves copper slower than many of the other solders.
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Electronics Forum | Wed Jan 11 15:08:55 EST 2006 | bobpan
My guess would be that the part/profile library is real large on the cp40. Try making a default library...add in your parts for just this job......and see if its faster
Electronics Forum | Mon Feb 13 09:54:45 EST 2006 | TZ
Why not use microwave oven, it would be faster ? Be careful, rheology and all paste's characteristics are strongly dependent from the "not stressing" reaction moving from low temperature to Room Temperature. Best regards TZ
Electronics Forum | Thu Jun 22 13:55:56 EDT 2006 | grantp
Hi, Cool, and that would be a fantastic idea to do it in the SMT phase with a machine, and much faster. Your right about the feeder costs, and I guess you might be able to pick up something second hand? Regards, Grant
Electronics Forum | Tue Aug 01 10:28:35 EDT 2006 | azbvc
Hi Davef, Could you elaborate more on faster separation speed is better of paste release. Any DOE have you performed before to prove that. My current paste printing practice is to make separation speed slow. Please advise.. rgds
Electronics Forum | Thu Sep 21 17:34:06 EDT 2006 | Cmiller
Amen. With the number of ads on here it must be generating revenue. Time to put some $$$ back in and improve this site. Not that it sucks, but it could be better. At least put it on a faster server.
Electronics Forum | Wed Feb 21 11:53:42 EST 2007 | SMTRework
Hi Russ, Thanks for the suggestion. I have the practical components sets that you mentioned, they take too long to do 10 pcs, the "pre-forms" are much faster. What equipment do you use for your automated process?
Electronics Forum | Fri Jul 20 08:26:52 EDT 2007 | cyber_wolf
SMT adhesive is hydroscopic. Some types absorb moisture faster than others. Moisture+SMT adhesive= pourous adhesive after cure. Excessive cure ramp rates can also contribute to porosity.
