Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Wed Jul 02 12:42:58 EDT 2003 | slthomas
Not sure how else to describe this. We've received some boards (1/2" x 3.5" x .0325" board built on panels of 24) with numerous resistors showing separation of the solder from the metallization at the top of the joint. There are 26 0805's on the bo
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Tue Jul 15 10:44:49 EDT 2003 | MA/NY DDave
Hi, Although I grit my teeth it does sound like a normal process engineer or engineering situation. Here you are with knowledge and ways to get knowledge of best practices and No One listens. ----- Now I have a cleanliness testing joke (real sto
Electronics Forum | Fri Jul 11 10:00:05 EDT 2003 | davef
Component manufacturers recommend limits on the power and period of ultrasonic cleaning. Examples are: * PRECAUTIONS AND GUIDELINES MULTILAYER CERAMIC CAPACITORS: (9) Ultrasonic cleaning time shall be ten minutes maximum. When the power of ultrasoni
Electronics Forum | Thu Dec 12 12:54:25 EST 2013 | jaimebc
For selective soldered components, or even hand soldered, with vertical bend components, the body of the component, in this case a resistor, is making contact with the surface of the PCB, making it impossibe to visually see the solder fillet. Or to d
Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef
For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Wed Jun 27 21:56:31 EDT 2012 | davef
I'm spinning on this. Are we talking PTH or SMT?
