Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Fri Sep 06 15:11:09 EDT 2002 | genny
Management is talking about the ability to do all our assembly in house. I would assume that realistically that we would eventually limit it to a few key products, but we are a high mix, relatively low volume company with volumes going up. We have
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Electronics Forum | Tue Aug 24 22:32:18 EDT 2004 | pdeuel
We have a Soltec Deltawave with single nozzle spray fluxer, chipwave, and waveform. It preforms well. I am not fimilar with Electrovert models so I can only give you some of the pitch I got when I went back East for training. Features I like about th
Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Mon Dec 11 05:30:11 EST 2006 | mika
[Drop down menus] > Machine > Configuration > Parameters > Axes => You are now on a page with 3 menus > on the left side menu [Axis choice] scroll down and mark [Transfer belts] > On the upper right menu [Configurable Values] > mark [Default maximum
Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika
Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a
Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika
Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra
Electronics Forum | Thu May 24 17:37:25 EDT 2007 | jmelson
I did one batch of low-density (0805 and standard SO chips) with excellent results. I then spent some time figuring out how to calibrate the mechanical alignment station (most of the calibration offsets on this machine were either zero or several mm
