Electronics Forum: fine pitch components (Page 216 of 227)

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon

| | We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi

Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.

| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only

Re: BGA rework : IR or convection

Electronics Forum | Wed May 19 10:56:52 EDT 1999 | Glenn Robertson

| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | M

Re: White Tin

Electronics Forum | Wed Apr 28 11:47:34 EDT 1999 | Frank Boyko

| | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | We are considering trying boards with White Tin solderable

Re: real placement rates

Electronics Forum | Fri Jul 24 09:50:13 EDT 1998 | Justin Medernach

200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | We don't even bother wit

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Fri Jun 05 19:33:55 EDT 1998 | Steve Gregory

Hidee Ho Brian! Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. We're a contract assembler as well, just starting up.

low volume /semi-automatic solutions

Electronics Forum | Tue Jun 17 16:10:01 EDT 2003 | russ

First, what would you define as semi-automatic? For SMT production you might need a screen printer (these can be anything from full manual to full auto. The low end printers manual require each board to be aligned with a piece of mylar prior to p

Researching placement machines - where do I start?!

Electronics Forum | Fri Nov 06 08:50:07 EST 2009 | jeffreyj

adlsmt - I do apply paste (Kester EP256) by hand to the boards now with 5 mil thick stainless steel stencils. A few of the parts almost always need rework, though, either because I didn't place them accurately or there's too much paste, or it got sme

85K grant. How best to use?

Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus

Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma

Re: Water Batch Cleaners

Electronics Forum | Thu Jun 24 19:14:44 EDT 1999 | Mike Konrad

Very good questions Bob� Given the fact that my company is a manufacturer of batch cleaning equipment, I will speak more in general terms rather than in specific terms. There are several criteria used in the evaluation of batch aqueous cleaning sys


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